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Dymax Corporation has introduced Ultra Light-Weld® 431, a versatile adhesive for glass-to-glass and glass-to-metal applications.
Dymax Corporation’s Ultra Light-Weld® 9671 is a UV/Visible light-curable adhesive designed for bonding LCP (liquid crystal polymer) on microspeaker housings.
Easy application and removal facilitates increased throughput.
In-line curing allows for increased production speed, lower processing costs, and reduced inventories.
Rapid curing maximizes production speed.
Rapid curing maximizes material usage and results in increased throughput and production capacity.
Curing speed enables faster processing and reduces cost.
Dymax Corporation offers Ultra Light-Weld® 9008, a light-curable encapsulant engineered to rapidly encapsulate and seal electronic components in chip-on-flex or chip-on-board applications.
Dymax Multi-Cure® 9-20557 cures in seconds upon exposure to UV/Visible light and is designed for rapid conformal coating of printed circuit boards and other electronic assemblies.